巴西专利BR102012005930B1 LIGHT SOURCE CIRCUIT UNIT AND LIGHTING DEVICE

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专利摘要:
light source circuit unit, lighting system and display device a light source circuit unit, lighting device and display device are provided which are capable of extracting light emitted from the rear surface of an element chip light emitting on the front surface, suppress the reflectance reduction and reduce costs, with a simple configuration. the light source circuit unit includes a circuit substrate that has a light reflecting wiring pattern on a surface thereof and includes a chip mounting layer as part of the wiring pattern, and one or more emitter element chips of light that are placed directly on the chip mounting layer and are driven by a current that passes through the wiring pattern.
公开号:BR102012005930B1
申请号:R102012005930-4
申请日:2012-03-16
公开日:2020-09-24
发明作者:Koichi Yamamoto；Takehito Hirose；Shigeru Teshigahara
申请人:Sony Corporation；
IPC主号:

专利说明:

[0001] [001] The present technology concerns a light source circuit unit and a lighting device that includes, as a light source, light-emitting elements such as light-emitting diodes (LED), and a light-emitting device. display including the lighting device as a backlight.
[0002] [002] Light emitting diodes (LED) have stood out as a backlight (light source) from a liquid crystal display device, or a light source from a lighting device in place of an incandescent lamp or a fluorescent lamp. Since LED emits light from surfaces in all directions, a certain reflective surface needs to be provided on the rear surface of the LED chip to extract light emitted from the rear surface on the front surface. A conductive frame or wiring pattern to supply a current to the LED chip typically includes copper (Cu). In an exemplary method of extracting light emitted from the rear surface of the LED chip on the front surface, a circuit substrate with a wiring pattern like this has a white resistance layer on it, and the white resistance layer is used as the layer reflective, as disclosed in Japanese patent 4,107,349. The light emitted by the rear surface of the LED chip is reflected on the front surface by the white resistance layer and extracted. SUMMARY OF THE INVENTION
[0003] [003] If a white resistance layer is heated in a treatment step after joining by stamping, wire joining, or soldering the LED chip, the white resistance layer is yellowish, and the reflectance of the layer is reduced. In other methods of light extraction, white paste is used to join the chip, or a reflective layer (silver metallic layer) is provided on the rear surface of the LED chip. Unfortunately, each method leads to an increase in cost.
[0004] [004] It is desirable to provide a light source circuit unit, a lighting device and a display device that are capable of extracting light emitted from the rear surface of a light emitting element chip on the front surface, suppressing the reduction in reflectance and reducing cost, with a simple setup.
[0005] [005] A light source circuit unit according to a technology modality includes a circuit substrate that has a light reflecting wiring pattern on a surface of the circuit and includes a chip mounting layer that is placed directly on the chip mounting layer, and is driven by a current that passes through the wiring pattern.
[0006] [006] A lighting device and a display device according to the type of technology each include a light source circuit unit.
[0007] [007] In the light source circuit unit, the lighting device and the display device according to the technology modality, light emitted by the rear surface of the light emitting element chip is reflected by the reflective chip mounting layer light, on which the relevant chip is mounted, and light is extracted from the front surface of the chip.
[0008] [008] According to the light source circuit unit, the lighting device and the technology mode display device, a part of the light reflective wiring pattern is formed as the chip mounting layer, and the Light-emitting element chip is directly placed on the chip-mounting layer, which allows the light emitted from the rear surface of the light-emitting element chip to be extracted to the front surface in a simple configuration, and eliminates the reduction in reflectance.
[0009] [009] It should be understood that both the general description presented and the following detailed description are exemplary, and are not intended to provide further explanation of the claimed technology. BRIEF DESCRIPTION OF THE DRAWINGS
[0010] [0010] The accompanying drawings are included to provide an additional understanding of the disclosure and are incorporated and form a part of this specification. The drawings illustrate modalities and, together with the specification, serve to explain the principles of technology.
[0011] [0011] Figure 1 is a sectional view illustrating a light source circuit unit according to a disclosure mode.
[0012] [0012] Figure 2 illustrates an electrode configuration of an LED chip.
[0013] [0013] Figures 3A and 3B are a plan view and a sectional view illustrating a light source circuit unit according to modification 1, respectively.
[0014] [0014] Figures 4A and 4B are a sectional view illustrating a light source circuit unit according to modification 2 and a plan view illustrating a reflective sheet.
[0015] [0015] Figure 5 is a sectional view illustrating a light source circuit unit according to modification 3.
[0016] [0016] Figure 6 illustrates a process for manufacturing a circuit substrate of the light source circuit unit according to modification 3.
[0017] [0017] Figure 7 illustrates a manufacturing process for the light source circuit unit according to modification 3.
[0018] [0018] Figure 8 is a sectional view illustrating a liquid crystal display device according to application example 1.
[0019] [0019] Figures 9A and 9B are a plan view and a sectional view illustrating a main part of a liquid crystal display device according to application example 2, respectively.
[0020] [0020] Figure 10 is a sectional view illustrating a liquid crystal display device according to application example 3.
[0021] [0021] Figure 11 is a sectional view illustrating a liquid crystal display device according to application example 4.
[0022] [0022] Figure 12 is a sectional view illustrating a liquid crystal display device according to application example 5.
[0023] [0023] Figure 13 illustrates a wiring configuration for another LED chip. DETAILED DESCRIPTION OF MODALITIES
[0024] 1. Modalidade (um exemplo onde um chip de LED é diretamente ligado por estampagem a um padrão de fiação). 2. Modificação 1 (um exemplo onde uma camada refletiva é adicionada). 3. Modificação 2 (um exemplo onde uma folha refletiva é adicionalmente incorporada). 4. Modificação 3 (um exemplo onde uma função de radiação é adicionada). 5. Exemplo de aplicação 1 (um exemplo de luz de fundo tipo direta). 6. Exemplo de aplicação 2 (um exemplo de substratos particionados). 7. Exemplo de aplicação 3 (um exemplo onde um substrato de circuito é dobrado e conectado a um substrato de acionamento em um lado de trás de um elemento de suporte). 8. Exemplo de aplicação 4 (um exemplo onde um substrato de circuito é curvo junto com um elemento de suporte). 9. Exemplo de aplicação 5 (um exemplo de uma luz de fundo tipo borda). [0024] In the following, a method of disclosure will be described in detail with reference to the attached drawings. The description is made in the following order. 1. Modality (an example where an LED chip is directly connected by stamping to a wiring pattern). 2. Modification 1 (an example where a reflective layer is added). 3. Modification 2 (an example where a reflective sheet is additionally incorporated). 4. Modification 3 (an example where a radiation function is added). 5. Application example 1 (an example of a direct backlight). 6. Application example 2 (an example of partitioned substrates). 7. Application example 3 (an example where a circuit substrate is folded and connected to a drive substrate on the back side of a support element). 8. Application example 4 (an example where a circuit substrate is curved together with a support element). 9. Application example 5 (an example of an edge-like backlight).
[0025] [0025] Figure 1 illustrates a configuration of the light source circuit unit 1 according to a development mode. This light source circuit unit 1 is used, for example, as a backlight of a display device such as a liquid crystal display device or as a light source circuit unit in place of an incandescent lamp. or a fluorescent lamp. The light source circuit unit includes a light emitting element chip, for example, an LED chip 13, covered with a dome-shaped seal lens 12 on a substrate of circuit 11. Although the number of chip LED 13 is one here, it can be two or more as in the modifications described below. In the case where the light source circuit unit 1 is applied to a direct type backlight, a large number of LED chips 13 are used in a matrix.
[0026] [0026] The substrate of circuit 11 has a light reflective wiring pattern 14 on a surface of it. Wiring pattern 14 includes, for example, a wiring layer 14A (first wiring layer) and a wiring layer 14B (second wiring layer) to supply a drive current to the LED chip 13, and a mounting layer chip 14C to mount the LED chip 13. The wiring layers 14A and 14B and the chip mounting layer 14C are formed of a conductive and light reflective material in one step, and are electrically separated from each other. In the modality, the 14C chip mounting layer works only as a base of the LED 13 chip and does not function as a wiring. Here, "reflective light" refers to a property of reflecting light emitted by the LED 13 chip ( rear surface) at a high reflectance of 90% or more. A light reflective material like this specifically includes, for example, aluminum (Al), silver (Ag) or their alloys. Among them, Al is the most preferable in view of the cost.
[0027] [0027] Incidentally, the spinning layers 14A and 14B and the chip mounting layer 14C are preferably formed from the same material and in the same step to simplify the above process. However, if the chip mounting layer 14C has the light reflective function, the chip mounting layer 14C can be formed of a different material and at a different stage of the wiring layers 14A and 14B.
[0028] [0028] The LED chip 13 has two electrodes (an electrode type n 13A and an electrode type p 13B) on a surface of the same, for example, as shown in figure 2. The LED chip 13 includes, for example, a interim storage layer 13b, a n-type coating layer 13c, an active layer 13d, a p-type coating layer 13e and a cover layer 13f on a transparent substrate 13a. Type n electrode 13A is electrically connected to the type n coating layer 13c and type p electrode 13B is electrically connected to the cover layer 13f.
[0029] [0029] The electrode type n 13A and the electrode type p 13B of the LED chip 13 are electrically connected in the wiring layers 14A and 14B by means of electrical connections (connecting wires) 15A and 15B including aluminum (Al) or gold ( Au), respectively. Specifically, the LED chip 13 is driven by a current that passes through the wiring layers 14A and 14B and electrical connections 15A and 15B for light emission.
[0030] [0030] In the modality, the LED chip 13 is directly mounted on the chip mounting layer 14C. Here, "directly" means that the rear surface itself (the transparent substrate described above) of the LED chip 13 is attached to the 14C chip mounting layer with the stamping or similar joining without packaging the LED chip 13 or without providing a layer reflective material such as a tin or gold metallization layer between the chip mounting layer 14C and the LED chip 13. Incidentally, an adhesive layer including a transparent paste 16 for the stamping bond can be disposed between the mounting layer of chip 14C and LED chip 13, as shown in figure 1. Although transparent paste 16 is not conductive in the modality, in the case where an LED chip with electrodes on both sides is used, transparent paste 16 is conductive because the chip mounting layer 14C functions as a current path, as described below.
[0031] [0031] The substrate of circuit 11 is preferably flexible and foldable, and can specifically include a resin film, such as poly (ethylene terephthalate) (PET), fluorine resin, or poly (ethylene naphthalate) (PEN), with a wiring pattern 14 printed on it. The thickness of the resin film, for example, is 20 μm to 50 μm, both inclusive, and the thickness of the spinning pattern 14 is, for example, 35 μm to 50 μm, both inclusive, however, this is not limiting.
[0032] [0032] Alternatively, the circuit 11 substrate may include a base metal substrate including Al, which has an insulating resin layer such as polyimide or epoxy resin on a surface thereof and has a spinning pattern including a printed reflective material in the insulating resin layer. Alternatively, the circuit 11 substrate may include a film base including a resin contained in the glass such as glass epoxy resin (FR4) or mixed glass resin (CEM3), on which the spinning pattern including the reflective material is printed .
[0033] [0033] A white resistance layer 17A and a water repellent layer 18 enclosing the LED chip 13 are stacked in this order between the respective wiring layers 14A and 14B and the periphery of the sealing lens 12. Furthermore, it is provided a white resistance layer 17B on the circuit substrate 11 between the chip mounting layer 14C and the respective wiring layers 14A and 14B in a region covered with the sealing lens 12. The white resistance layer includes, for example, a inorganic material such as fine particle of titanium oxide (TiO2) and fine particle of barium sulfate (BaSO4) and an organic material such as fine particle of porous acrylic resin or fine particle of polycarbonate resin with numerous pores for light scattering. Specifically, for example, a FINEDEL DSR-330 S42-13W solder resistance (registered trademark, manufactured by TAMURA KAKEN CORPORATION), can be used. The white resistance layers 17 (17A and 17B) each have a certain light reflection function (a reflectance of the lower half of the 80% range), although the reflectance can be inconveniently reduced. In the modality, the white resistance layers 17 (17A and 17B) function as reflective layers (auxiliary reflective layers) on the periphery of the LED chip 13. Although the resistance layers 17A and 17B are separated from each other in figure 1, they are provided as a solid film on the entire substrate surface of circuit 11, except for an assembly region of LED chip 13 and connection regions of LED chip 13 in wiring layers 14A and 14B. The water-repellent layer 18 is provided to form the sealing lens 12 covering the LED chip 13 in a predetermined form. The water-repellent layer 18 is formed of a water-repellent material such as fluorine resin and has a pattern (e.g., a ring pattern) corresponding to the pattern of the base of the sealing lens 12.
[0034] [0034] The sealing lens 12 protects the LED chip 13, and improves the efficiency of extracting L light emitted by the LED chip 13. The sealing lens 12 includes, for example, a transparent resin such as silicon resin or acrylic and covers the entire 13 LED chip.
[0035] [0035] The sealing lens 12 may contain a fluorescent substance. For example, the transparent resin such as silicon or acrylic resin is mixed with the fluorescent substance at a weight ratio of 10% and thus the hue of the light emitted by the entire LED chip 13 can be adjusted. Specifically, when light with a predetermined wavelength is emitted by the LED chip 13, the fluorescent substance contained in the sealing lens 12 is excited, leading to the production of light with a wavelength different from the emitted wavelength. The fluorescent substance can include, for example, a yttrium / aluminum / garnet (YAG) fluorescent substance.
[0036] [0036] The light source circuit unit 1 can be produced according to the following process, for example.
[0037] [0037] First, the transparent paste 16 is applied to the chip mounting layer 14C of the wiring pattern 14 in advance provided on the substrate of the circuit 11 described previously and the LED chip 13 is mounted on the chip mounting layer 14C and then the paste 16 is heated to be cured. Then, the respective two electrodes (the electrode type n 13A and the electrode type p 13B) of the LED chip 13 are connected by wire in the wiring layers 14A and 14B with the electrical connections 15A and 15B.
[0038] [0038] Thereafter, the resistance layer 17 is formed on the entire substrate surface of the circuit 11, except the mounting region of the LED chip 13 and the connection regions between the LED chip 13 and the wiring layers 14A and 14B. The water-repellent layer 18 is then formed in the resistance layer 17, and then fusion is carried out around the LED chip 13 attached to the chip mounting layer 14C, for example, with silicon resin as the sealing agent. An appropriate amount of resin material is used for such a fusion, and the resin material is cured by heating for 4 hours at a temperature of 150 ° C, for example. Consequently, the bell-shaped sealing lens 12 is formed, and the light source circuit unit 1 shown in figure 1 can be achieved.
[0039] [0039] In the light source circuit unit 1, light emitted by the LED chip 13 is largely extracted forward through the sealing lens 12, but partially goes to the substrate of circuit 11 from the rear surface of the chip. LED 13 (backlight). The background emission light is reflected by the surface of the chip mounting layer 14C with the high light reflection function, on which the LED chip 13 is mounted, and extracted forwards, as shown by the arrow L in figure 1. In the case where a diffuser sheet (not shown) is arranged above the light source circuit unit, part of the reflective light is reflected by the diffuser sheet and returned to the substrate of circuit 11, and also returned back to the diffuser sheet by the layer of white resistance 17 which has the light reflective function.
[0040] [0040] In this way, in the modality, the LED chip 13 is directly connected by stamping in the partial region (the chip mounting layer 14C) of the high reflectance wiring pattern 14 including Al, and the chip mounting layer 14C it is used as a reflective layer. Consequently, expensive silver plating is unnecessary for the reflective layer and a typical LED chip can be used as such without the need for a reflective layer to be formed on the back surface of the chip beforehand. In addition, a typical transparent (cheap) paste can be used as the binding paste. Consequently, the configuration for extracting light and the manufacturing process are simplified, and a cost reduction is achieved.
[0041] [0041] Modifications 1 to 3 of the aforementioned modality are described below. The components common to those of the modalities described above are designated by the same symbols, and the description of the components and common advantages are omitted.
[0042] [0042] (Modification 1)
[0043] [0043] A light source circuit unit 2 shown in figures 3A and 3B has a plurality of LED chips 13 (for example, two), each of which is covered with the sealing lens 12, as previously described, on the substrate of circuit 11. A reflective layer 22 including the same reflective material (for example, Al) of the spinning pattern 14 is provided substantially over the entire area of a bare portion of the spinning pattern 14 (the spinning layers 14A and 14B and the chip mounting layer 14C) on the substrate of the circuit 11 through the same printing step as the wiring pattern 14. An optical sheet such as a diffuser sheet 21 is arranged above the light source circuit unit 2.
[0044] [0044] In the light source circuit unit 2, the background emitting light from the rear surface of the LED chip 13 to the substrate of the circuit 11 is reflected by the surface of the chip mounting layer 14C with a reflective function of light and extracted forward, as shown by the arrow in figure 1, as in the above-described modality. Furthermore, in the light source circuit unit 2, the light drawn forward is widely diffused by the diffuser sheet 21, but partially reflected by the sheet and returned to the substrate of circuit 11. The light returned from the diffuser sheet 21 is effectively reflective again in the diffuser sheet 21 by the reflective layer 22 provided in the uncovered region of the wiring pattern 14. In the case where the sealing lens 12 contains a fluorescent substance, light that is emitted in the sealing lens 12 and goes to the circuit substrate 11 is also reflected in the diffuser sheet 21 by the reflective layer 22.
[0045] [0045] If the white resistance layer used in the light source circuit unit 1 is heated during the treatment step after stamping, wire joining or welding joining, the reflectance of the white resistance can be reduced. In the light source circuit unit 2, however, since the reflective layer 22 is provided in the same printing step as the wiring pattern 14 in place of the white resistance, the reflectance is not reduced and a reduction of cost. (Modification 2)
[0046] [0046] In a light source circuit unit 3 shown in figure 4A, a reflective sheet 23 is additionally provided above the reflective layer 22 between LED chips 13 and 13 of the light source circuit unit 2 of modification 1 in order to achieve an additional increase in luminance. Figure 4B illustrates a planar configuration of the reflective sheet 23, where openings 23A are provided in positions corresponding to the sealing lenses 12. For reflective sheet 23, although the same material (for example, Al) of the wiring pattern 14 can be used , a material with a higher reflectance, for example, white PET, can be used. (Modification 3)
[0047] [0047] In a light source circuit unit 4 shown in figure 5, a thermally radiant metal foil 24 is laminated to the rear surface of the circuit substrate 11 of the light source circuit unit 2 described above and attached to a rear chassis 26 together with the circuit 11 substrate with screws 25A and 25B. The foil 24 specifically includes an Al or Cu sheet with a thickness of 50 μm to 150 μm, both inclusive, for example. If the foil 24 has a strip of thickness like this, the substrate of the circuit 11 can be folded together with the foil 24. The foil 24 can be integrally attached to the rear surface of the substrate of the circuit 11 by a roll process in roll, for example, as shown in figure 6. Specifically, a resin film 27A, a sheet of Al 28A and an adhesive sheet 29A are fed from a roll of resin film 27, a roll of Al 28 sheet and a roll adhesive 29, respectively, by means of an intermediate roller 30. The sheet of Al 28A is laminated across the back surface of the roll of resin film 27A by a pressure roller 31. Thereafter, a spinning pattern of Al or similar is printed on the surface of the resin film 27A by a spinning pattern printer 32. The resin film 27A on which the spinning pattern is printed is cut to a desired size by a guillotine 33, and therefore the substrate of circuit 11 with foil 24 on a surface the same rear is produced. It is noted that the method described above is not limiting, and that other methods, which can provide the foil 24 on the substrate of the circuit 11 without wrinkles before the embossing union of the LED chip 13, can be used. As the adhesive agent, for example, epoxy resin is used. It is noted that highly heat-conducting particles such as aluminum particles can be mixed in the adhesive to increase thermal conductivity in order to improve the thermal radiation effect described below.
[0048] [0048] The foil 24 is provided on the rear surface without wrinkles in this way, and thus the substrate of the circuit 11 becomes firm (has a certain resistance) despite its flexibility, allowing joining by stamping or joining by wire using a typical substrate fixation process with adsorption.
[0049] [0049] Figure 7 illustrates a process of fixing a substrate with a wire binder. In the wire binder, the substrate of circuit 11 is arranged on a base 34 with a plurality of adsorption holes 34A so that the substrate of circuit 11 is attached to the base 34 by vacuum adsorption through the adsorption holes 34A. in this state, wire connection is made with a head 35. Since the substrate of circuit 11 in modification 3 at this moment has an appropriate hardness because of the foil 24, wrinkles hardly occur on the substrate of circuit 11. Consequently, bonding by automatic wire can be made merely using a typical binder without increasing the number of 34A adsorption holes.
[0050] [0050] Furthermore, in the modality, the heat generated by the LED chip 13 is transmitted to the entire surface of the foil 24 (Al foil) and efficiently transmitted to the rear chassis 26 by means of the foil 24. Specifically , the foil 24 can effectively provide a heat radiation effect. Furthermore, in the case where the foil 24 and the reflective layer 22 on the side of the front surface of the substrate of circuit 11 include the same material, for example, Al, and have the same thickness, the coefficient of thermal expansion is substantially the even between the two sides of the circuit 11 substrate, thus leading to a suppression effect of the warping 11 substrate.
[0051] [0051] The above-described light source circuit units 1 to 4 are foldable and thus can be applied to lighting devices for various applications, such as street lights or lighting for surgical operations. Furthermore, each light source circuit unit can be applied to a backlight (a lighting device) of a display device, such as a liquid crystal display device. In such a case, the light source circuit unit can be applied both in direct type backlight, where the light source unit is arranged directly below a liquid crystal panel, and in the edge type backlight, where the light source is arranged on an edge of a light guide plate. (Application example 1)
[0052] [0052] Figure 8 illustrates a configuration of a liquid crystal display device using a direct type backlight 40. The backlight 40 includes, for example, a light source circuit unit 1 arranged at the bottom of a rear chassis 41 (support element). An intermediate chassis 42 supports an optical sheet, for example, a diffuser sheet 43 above the light source circuit unit 1. A diffuser sheet 44 is also provided on each side wall of the rear chassis 41.
[0053] [0053] In the liquid crystal display device, light L extracted from the sealing lens 12 of the light source circuit unit 1 passes widely through the diffuser sheet 43 and reaches a liquid crystal panel 45, and part of the light L it is reflected by the diffuser sheets 43 and 44. The reflected light is returned to the diffuser sheet 43 by the aforementioned white resistance layer or reflective sheet and arrives at the liquid crystal panel 45, resulting in the image being displayed. (Application example 2)
[0054] [0054] In the backlight of the aforementioned direct type, it is difficult to manufacture a large light source circuit unit 1 due to the reasons for manufacturing the substrate, so that the substrate is partitioned into small parts in some cases. Figures 9A and 9B illustrate a backlight configuration 50 using such partitioned substrates. Figure 9A shows a planar configuration of the backlight 50, and Figure 9B shows a sectional configuration thereof. The backlight 50 includes, for example, the light source circuit units 1 arranged on the bottom of a rear chassis 51 (support element). The plurality of light source circuit units 1 is provided in parallel and a reflective sheet 58 is provided in common for the plurality of light source circuit units 1. Reflective sheet 58 is formed, for example, from Al, and has 51A openings corresponding to LED chips 13.
[0055] [0055] An intermediate chassis 52 supports a diffuser sheet 53 above the light source circuit units 1. A liquid crystal panel 54 is provided in front of the backlight 50. A substrate of the LED drive circuit 55 to supply a drive current to the light source circuit units 1 is provided on the rear surface of the rear chassis 51. The drive circuit substrate of LED 55 has a connector 55A. One end of a flexible flat cable (FFC) 57 is connected on the side of the reflective sheet 51 by thermocompression bonding with anisotropic conductive resin (AFC) 56 between them. The rear chassis 51 has a through hole 57A with a shape corresponding to an end pattern (a rectangle) of the FFC 57. Figure 57 is folded from inside the rear chassis 51 along its rear surface through the through hole 57A. One end of the FFC 57 is formed as a plug that is inserted into a connector 55A of the LED 55 drive circuit substrate for electrical coupling.
[0056] [0056] In the liquid crystal display device with a backlight 50 like this, since partitioned substrates are used, even if a defective substrate is produced partially because of the stamping bond, only the defective substrate needs to be repaired without the need to repair all substrates. (Application example 3)
[0057] [0057] Figure 10 illustrates a configuration of a liquid crystal display device according to application example 3. A backlight 60 includes, for example, the light source circuit unit 1 arranged at the bottom of a rear chassis 61. An intermediate chassis 62 supports a diffusing sheet 63 above the light source circuit unit 1. A liquid crystal panel 64 is provided in front of the backlight 60. A substrate for the driving circuit of LED 65 is provided on the rear surface of the rear chassis 61. The substrate of the LED insulating layer circuit 65 has a 65A connector. The rear chassis 61 has a through hole 61A with a section corresponding to an end face pattern (a rectangle) of the substrate of circuit 11 of the light source circuit unit 1. An end portion of the substrate of circuit 11 is folded along the rear surface of the rear chassis 61 through the through hole 61A. One end of the substrate of circuit 11 is formed as a plug that is inserted into a connector 65A of the substrate of the drive circuit of LED 65 for electrical coupling. In the case where the wiring pattern 14 on the substrate of circuit 11 is formed of Al, and a terminal of connector 65A is formed with metallization with gold (Au), one end of the plug of the substrate of circuit 11 is desirably metallized with gold or tin in order to prevent electrolytic corrosion caused by a different metal.
[0058] [0058] In the past, the substrate of the LED circuit was electrically connected to the driving substrate of the LED by means of coupling between connectors of the respective substrates with a wiring element such as FFC or a wire network. However, since the unit price of the LED itself has decreased significantly, the cost of a connector terminal or a wiring element is not negligible. In the embodiment, the circuit substrate 11 of the light source circuit unit 1 is flexible and foldable towards the rear surface side of the rear chassis 61 shown in figure 10, and thus the connector and the wiring element on the circuit 11 substrate are unnecessary, allowing a reduction in the number of components and cost. (Application example 4)
[0059] [0059] Figure 11 also illustrates a configuration of a liquid crystal display device including a direct type backlight. A backlight 70 includes, for example, the light source circuit unit 1 arranged at the bottom of the rear chassis 71. An intermediate chassis 72 supports a diffuser sheet 73 above the light source circuit unit 1. The light source circuit 1 additionally has a reflective foil 23. A liquid crystal panel 74 is provided in front of the backlight 70. a substrate of the drive circuit of LED 75 to supply a drive current to the source circuit unit light 1 is provided on the rear surface of the rear chassis 71. The substrate of the LED 75 drive circuit has a 75A connector. The light source circuit unit 1 is electrically connected to the substrate of the LED 75 drive circuit in the same way as in application example 3. A rear cover 76 (rear protective element) covers the rear surface of the rear chassis 71 up to the periphery of the front surface of the liquid crystal panel 74.
[0060] [0060] In the backlight 70, the rear chassis 71 is curved towards the vertical and horizontal end faces of the backlight 70, and the light source circuit unit 1 is correspondingly curved. In this light source circuit unit 1, the pitch between the LED chips 13 is smaller at a position closer to each of the vertical and horizontal end faces in response to an increase in curvature. The drive current applied to the LED chips 13 is also decreased by decreasing the pitch, or an increase in the density of the LED chips. The rear cover 76 also has a taper 76A corresponding to the curvature of the rear chassis 71.
[0061] [0061] Specifically, the rear chassis 71 and the light source circuit unit 1 are curved to reduce the thickness in a position closer to each of the vertical and horizontal end faces, and the rear cover 76, correspondingly, has a 76A taper so that the liquid crystal display device as a whole looks thin. In the liquid crystal display device with a configuration like this, the LED chip 13 of the light source circuit unit 1 has a smaller optical distance from the liquid crystal panel 74 in a position closer to each end face of the unit of light source circuit 1, and thus, if the steps between the chips are regular, spot-type luminance irregularity caused by the LED chips occurs. In application example 4, the pitch between the LED chips 13 varies in correspondence with the degree of curvature of the light source circuit unit 1, and the drive current applied to the LED chips 13 also varies in response to the variation of the step. This makes it possible to control the surface luminance of the liquid crystal panel 74 to be uniform. (Application example 5)
[0062] [0062] Figure 12 illustrates a configuration of a liquid crystal display device including an edge-like backlight. A backlight 80 includes, for example, the light source circuit unit 1 which is arranged on a side wall of a rear chassis 81 (support element) so as to be opposite an end face of a guide plate light 81. An intermediate chassis 82 supports a diffuser sheet 83 above the light source circuit unit 1. A liquid crystal panel 84 is provided in front of the backlight 80.
[0063] [0063] In the liquid crystal display device, the radiation direction of the light L extracted from the sealing lens 12 of the light source circuit unit 1 is changed by the light guide plate 81 so that the light goes into the leaf diffuser 83. After that, as in the case shown in figure 8, the light L passes widely through the diffuser sheet 83 and arrives at the liquid crystal panel 84, and part of the light L is reflected by the diffuser sheet 83. The reflected light is returned to the diffuser sheet 83 by the aforementioned white resistance layer or reflective sheet and reaches the liquid crystal panel 84, resulting in the image being displayed.
[0064] [0064] Although the technology has been described with the modality and modifications presented, it is not intended that the technology be limited to modality and the like, and may contain several modifications or changes. For example, although the modality and the like have been described with cutter holder 13 with two electrodes on one side, a type of LED chip 61 shown in figure 13 can be used, where an electrode type n 61A and an electrode type p 61B are provided opposite each other on the respective sides of the LED chip. In such a case, the chip mounting layer 14C is formed in an integrated manner with the spinning layer 14B and the transparent paste 62 is formed of a conductive material. Specifically, a drive current is supplied to the type 61 electrode p 61B of the LED chip 61 through the wiring layer 14A and the wire 15A, and supplied to the type 61 electrode via the wiring layer 14B and the chip mounting layer 14C .
[0065] [0065] The present technology can have the following configurations. (1) A light source circuit unit including: a circuit substrate that has a light reflecting wiring pattern on a surface of the circuit and includes a chip mounting layer as a part of the wiring pattern; and one or more chips of light-emitting elements that are directly placed in the chip assembly layer, and are driven by a current that passes through the wiring pattern. (2) The light source circuit unit according to (1), additionally including a sealing lens on the circuit substrate, the sealing lens covering the light emitting element chip and its periphery. (3) The light source circuit unit according to (1) or (2), in which the light-emitting element chip is configured from a light-emitting diode. (4) The light source circuit unit according to any one of (1) to (3), where: the light-emitting element chip has a pair of electrodes on one side; and the wiring pattern includes first and second layers of wiring that electrically connect the chip mounting layer to the two respective electrodes of the light emitting element chip. (5) The light source circuit unit according to any one of (1) to (4), where: the light-emitting element chip has first and second electrodes on its respective two sides; and the wiring pattern includes a first wiring layer that serves as the chip mounting layer and is electrically connected to the first electrode of the light emitting element chip, and a second layer of electrically connected wiring to the second electrode of the emitting element chip of light. (6) The light source circuit unit according to any one of (1) to (5), additionally including: a layer of white resistance between the wiring pattern and the sealing lens; and a reflective layer formed from the same material as the white resistance layer between sub-plates of the wiring pattern in a region covered with the sealing lens. (7) The light source circuit unit according to any one of (1) to (4), additionally including a reflective layer at least between sub-patterns of the wiring pattern in a region covered with the sealing lens on the substrate of the circuit, the reflective layer being formed of the same material as the wiring pattern. (8) The light source circuit unit according to any one of (1) to (7), additionally including a reflective sheet with an opening corresponding to the sealing lens over the entire area above the circuit substrate. (9) The light source circuit unit according to any one of (1) to (8), where the circuit substrate is configured from a resin film with a spinning pattern printed on it, a metal substrate reflective with an insulating film on one surface and the spinning pattern printed on the insulating film, or a resin film contained in glass with the spinning pattern printed on it. (10) The light source circuit unit according to any one of (1) to (9), in which two or more chips of light-emitting elements are provided on the circuit substrate, and the reflective layer is provided by the entire surface of the circuit substrate including a region between the chips of the light-emitting elements. (11) The light source circuit unit according to any one of (1) to (10), wherein the thermally radiant metal sheet is laminated to the rear surface of the circuit substrate. (12) A lighting device including: a light source circuit unit; a support element that supports the light source circuit unit therein; and a diffuser sheet disposed opposite the entire area of the light source circuit unit; wherein the light source circuit unit includes a circuit substrate that has a light reflective wiring pattern on a surface thereof and includes a chip mounting layer as part of the wiring pattern, and a plurality of light-emitting elements that are placed directly on the chip mounting layer, and are driven by a current that passes through the wiring pattern. (13) A lighting device including: a light guide plate; a support element that supports the light guide plate on it; a diffuser plate disposed opposite the entire area of the light guide plate; and a light source circuit unit disposed opposite an end face of the light guide plate on the support element; where the light source circuit unit includes: a circuit substrate that has a light reflecting wiring pattern on a surface of the circuit and includes a chip mounting layer as part of the wiring pattern; and a plurality of light-emitting element chips that are placed directly on the chip mounting layer, and are driven by a current that passes through the wiring pattern. (14) A lighting device including: a support element with a through hole from the front surface to the rear surface of the support element; an optical sheet supported in front of the support element; a drive substrate with a connector and disposed on the rear surface of the support element; and a foldable light source circuit unit that is arranged between the optical sheet and the support element, which extends to the rear surface of the support element through the through hole, and is electrically connected to the drive substrate via the connector; wherein the light source circuit unit includes: a circuit substrate that has a reflective wiring pattern of light on a surface thereof and includes a chip mounting layer as part of the wiring pattern; and one or more chips of light-emitting elements that are directly placed in the chip assembly layer and are driven by a current that passes through the wiring pattern. (15) A lighting device including: a support element with a through hole from the front surface to the rear surface of the support element; an optical sheet supported in front of the support element; a drive substrate with a connector and disposed on the rear surface of the support element; a plurality of light source circuit units provided in parallel between the optical sheet and the support element; and a collapsible connecting element that extends from within the support element to a rear surface thereof through the through-hole and is electrically connected to each of the plurality of light source circuit units by means of an anisotropic conductive resin and on the drive substrate by means of the connector; where the light source circuit unit includes: a circuit substrate that has a light reflecting wiring pattern on a surface of the circuit and includes a chip mounting layer as part of the wiring pattern; and one or more chips of light-emitting elements that are directly placed in the chip assembly layer, and are driven by a current that passes through the wiring pattern. (16) A lighting device including: an optical sheet; a support element with a curved bottom that allows the distance of the optical sheet to be gradually reduced from the center of the support element to an end face thereof; a foldable light source circuit unit that has a plurality of light emitting element chips in (one or more) rows and is accommodated in the support element along the curved bottom; and a rear protective element that covers the entire rear surface of the support element in the vicinity of both ends of the optical sheet, and has an inclined surface according to the curved bottom of the support element; wherein the light source circuit unit includes: a circuit substrate that has a reflective wiring pattern of light on a surface thereof and includes a chip mounting layer as part of the wiring pattern; and one or more chips of light-emitting elements that are directly placed in the chip assembly layer, and are driven by a current that passes through the wiring pattern. (17) Lighting device according to (16), in which the pitch of the plurality of chips of light-emitting elements arranged in a direction of the row is reduced with the decrease of the width of the accommodation space. (18) The lighting device according to (17), wherein the driving current applied to the plurality of light-emitting element chips is adjusted to allow the surface luminance to be uniform in response to the step of the plurality of element chips. light emitters arranged in the direction of the row. (19) Display device including: a display panel; and a light source circuit unit as a light source for the display panel; where the light source circuit unit includes: a circuit substrate that has a light reflective wiring pattern on a surface of the circuit and includes a chip mounting layer as part of the wiring pattern; and one or more chips of light-emitting elements that are directly placed in the chip assembly layer, and are driven by a current that passes through the wiring pattern.
[0066] [0066] The present disclosure contains subject matter related to that disclosed in the Japanese priority patent application JP 2011-64582 filed with the Japan Patent Office on March 23, 2011, whose entire content is hereby incorporated by reference.
[0067] [0067] Those skilled in the art must understand that various modifications, combinations, subcombination and alterations can occur, depending on the design requirements and other factors, as long as they are within the scope of the attached claims or their equivalents.

权利要求:
Claims (32)
[0001]
Light source circuit unit (1), characterized by the fact that it comprises: a circuit substrate (11) that has a wiring pattern (14) on its surface, and includes a chip mounting layer (14C) as a part of the wiring pattern (14), in which the wiring pattern (14) is formed of light reflecting material; one or more chips of light-emitting elements (13) that are directly placed in the chip assembly layer (14C), and are driven by a current that passes through the wiring pattern (14); a reflective sheet (23) with an opening corresponding to one or more light-emitting element chips (13) in the entire area above the circuit substrate (11), and a reflective layer that includes the same light-reflecting material as the wiring pattern (14) is provided in the area of an uncovered portion of the wiring pattern (14) on the circuit substrate (11) through the same printing step as that of the wiring pattern (14).
[0002]
Light source circuit unit (1) according to claim 1, characterized in that it comprises a matrix connection layer between the chip mounting layer (14C) and the chips.
[0003]
Light source circuit unit (1) according to claim 1 or 2, characterized in that it additionally comprises a sealing lens (12) on the substrate of the circuit (11), the sealing lens (12) covering the light-emitting element chip (13) and its periphery.
[0004]
Light source circuit unit (1) according to any one of claims 1 to 3, characterized in that the light emitting element chip (13) is configured as a light emitting diode.
[0005]
Light source circuit unit (1) according to any one of claims 1 to 4, characterized in that: the light-emitting element chip (13) has a pair of electrodes on one side; and the wiring pattern (14) includes first and second wiring layers that electrically connect the chip mounting layer (14C) to the two respective electrodes of the light emitting element chip (13).
[0006]
Light source circuit unit (1) according to any one of claims 1 to 4, characterized in that: the light-emitting element chip (13) has first and second electrodes on its respective two sides; and the wiring pattern (14) includes a first wiring layer that serves as the chip mounting layer (14C) and is electrically connected to the first electrode of the light emitting element chip (13), and a second electrically wiring layer connected to the second electrode of the light-emitting element chip (13).
[0007]
Light source circuit unit (1) according to claim 1, characterized in that it additionally comprises: a sealing lens (12) on the circuit substrate (11), the sealing lens (12) covering the chip of the light-emitting element (13) and its periphery; a white resistance layer (17A) between the wiring pattern (14) and the sealing lens (12); and a reflective layer formed from the same material as the white resistance layer (17A) between sub-plates of the wiring pattern (14) in a region covered with the sealing lens (12).
[0008]
Light source circuit unit (1) according to claim 1, characterized in that it additionally comprises: a sealing lens (12) on the circuit substrate (11), the sealing lens (12) covering the chip of the light-emitting element (13) and its periphery; a reflective layer at least between sub-patterns of the wiring pattern (14) in a region covered with the sealing lens (12) on the circuit substrate (11), the reflective layer being formed of the same material as the wiring pattern ( 14).
[0009]
Light source circuit unit (1) according to any one of claims 1 to 8, characterized in that the circuit substrate (11) is configured from a resin film with a printed spinning pattern (14) on it, a reflective metal substrate with an insulating film on a surface thereof and the spinning pattern (14) printed on the insulating film, or a resin film contained in glass with the spinning pattern (14) printed on it.
[0010]
Light source circuit unit (1) according to any one of claims 1 to 9, characterized in that two or more light-emitting element chips (13) are provided in the circuit substrate (11), and the reflective layer is provided over the entire substrate surface of the circuit (11) including a region between the chips of the light-emitting elements (13).
[0011]
Light source circuit unit (1) according to any one of claims 1 to 10, characterized in that the thermally radiant metal sheet is laminated to the rear surface of the circuit substrate (11).
[0012]
Light source circuit unit (1) according to any one of claims 1 to 11, characterized in that the light reflecting material is a material that has a light reflectance character over the entire wavelength scope visible light.
[0013]
Light source circuit unit (1) according to claim 3, 7 or 8, characterized in that it further comprises fluorescent material contained in the sealing lens (12).
[0014]
Light source circuit unit (1) according to claim 3, 7 or 8, characterized in that it further comprises fluorescent material contained in the sealing lens (12), in which the light output of the fluorescent material has a wavelength different from the light emitted by the chips of the light-emitting element (13).
[0015]
Light source circuit unit (1) according to claim 1, characterized in that it comprises fluorescent material, wherein the light output of the fluorescent material has a different wavelength than the light emitted by the emitting element chips light (13).
[0016]
Lighting device, characterized by the fact that it includes: a light source circuit unit (1); a support element that supports the light source circuit unit (1) therein; and a diffuser sheet disposed opposite the entire area of the light source circuit unit (1); wherein the light source circuit unit (1) includes a circuit substrate (11) that has a wiring pattern (14) on a surface thereof and includes a chip mounting layer (14C) as part of the pattern spinning (14), where the spinning pattern (14) is formed of light reflective material; and a plurality of light-emitting element chips (13) that are placed directly on the chip assembly layer (14C), and are driven by a current that passes through the wiring pattern (14); a reflective sheet (23) with an opening corresponding to the light-emitting element chips (13) in the entire area above the circuit substrate (11), and a reflective layer that includes the same light-reflecting material as the wiring pattern (14) is provided in the area of an uncovered portion of the wiring pattern (14) on the circuit substrate (11) through the same printing step as that of the wiring pattern (14).
[0017]
Lighting device according to claim 16, characterized by the fact that it further comprises a matrix connection layer between the chip mounting layer (14C) and the chips; and the reflective material of light is a material that has a luminous character of high reflectance equal to or greater than 90% over the entire wavelength range of visible light.
[0018]
Lighting device, characterized by the fact that it includes: a light guide plate; a support element that supports the light guide plate therein; a diffuser plate disposed opposite the entire area of the light guide plate; and a light source circuit unit (1) disposed opposite an end face of the light guide plate on the support element; wherein the light source circuit unit (1) includes: a circuit substrate (11) that has a wiring pattern (14) on a surface thereof and includes a chip mounting layer (14C) as part of the wiring pattern (14), where the wiring pattern (14 ) is formed of light reflecting material; and a plurality of light-emitting element chips (13) that are placed directly on the chip assembly layer (14C), and are driven by a current that passes through the wiring pattern (14); a reflective sheet (23) with an opening corresponding to the light-emitting element chips (13) in the entire area above the circuit substrate (11), and a reflective layer that includes the same light-reflecting material as the wiring pattern (14) is provided in the area of an uncovered portion of the wiring pattern (14) on the circuit substrate (11) through the same printing step as that of the wiring pattern (14).
[0019]
Illumination device according to claim 18, characterized by the fact that the light reflective material is a material that has a luminous character of high reflectance equal to or greater than 90% over the entire wavelength range of visible light; a sealing lens (12) on the circuit substrate (11), the sealing lens (12) covering the chip of the light-emitting element (13) and its periphery; and a matrix bonding layer between the chip mounting layer (14C) and the chips.
[0020]
Lighting device according to claim 19, characterized by the fact that it also comprises fluorescent material contained in the sealing lens (12).
[0021]
Lighting device according to claim 19, characterized by the fact that it also comprises fluorescent material contained in the sealing lens (12), in which the light output of the fluorescent material has a wavelength different from the light emitted by the chips of the light-emitting element (13).
[0022]
Lighting device according to claim 19, characterized in that it comprises fluorescent material, in which the light output of the fluorescent material has a different wavelength than the light emitted by the light emitting element chips (13).
[0023]
Lighting device, characterized by the fact that it comprises: a support element with a through hole from the front surface to the rear surface of the support element; an optical sheet supported in front of the support element; a drive substrate with a connector and disposed on the rear surface of the support element; and a foldable light source circuit unit (1) that is arranged between the optical sheet and the support element extends to the rear surface of the support element through the through hole, and is electrically connected to the drive substrate by means of the connector; wherein the light source circuit unit (1) includes: a circuit substrate (11) that has a wiring pattern (14) on a surface thereof and includes a chip mounting layer (14C) as part of spinning pattern (14), wherein the spinning pattern (14) is formed of a light reflective material; and one or more light-emitting element chips (13) that are directly placed on the chip assembly layer (14C) and are driven by a current that passes through the wiring pattern (14); a reflective sheet (23) with an opening corresponding to one or more light-emitting element chips (13) in the entire area above the circuit substrate (11), and a reflective layer that includes the same light-reflecting material as the wiring pattern (14) is provided in the area of an uncovered portion of the wiring pattern (14) on the circuit substrate (11) through the same printing step as that of the wiring pattern (14).
[0024]
Illumination device according to claim 23, characterized by the fact that the light reflective material is a material that has a luminous character of high reflectance equal to or greater than 90% over the entire wavelength range of visible light.
[0025]
Lighting device, characterized by the fact that it comprises: a support element with a through hole from the front surface to the rear surface of the support element; an optical sheet supported in front of the support element; a drive substrate with a connector and disposed on the rear surface of the support element; a plurality of light source circuit units (1) provided in parallel between the optical sheet and the support element; and a collapsible connecting element that extends from within the support element to a rear surface thereof through the through hole, and is electrically connected to each of the plurality of light source circuit units by means of an anisotropic conductive resin and on the drive substrate by means of the connector; wherein the light source circuit unit (1) includes: a circuit substrate (11) that has a wiring pattern (14) on a surface thereof and includes a chip mounting layer (14C) as part of spinning pattern (14), where the spinning pattern (14) is formed of light reflecting material; and one or more chips of light-emitting elements (13) that are directly placed in the chip assembly layer (14C), and are driven by a current that passes through the wiring pattern (14); a reflective sheet (23) with an opening corresponding to one or more light-emitting element chips (13) in the entire area above the circuit substrate (11), and a reflective layer that includes the same light-reflecting material as the wiring pattern (14) is provided in the area of an uncovered portion of the wiring pattern (14) on the circuit substrate (11) through the same printing step as that of the wiring pattern (14).
[0026]
Lighting device according to claim 25, characterized by the fact that the light reflective material is a material
[0027]
Lighting device, characterized by the fact that it comprises: an optical sheet; a support element with a curved bottom that allows the distance of the optical sheet to be gradually reduced from the center of the support element to an end face thereof; a foldable light source circuit unit (1) which has a plurality of light emitting element chips (13) in (one or more) rows and is accommodated in the support element along the curved bottom; and a rear protective element that covers the entire rear surface of the support element in the vicinity of both ends of the optical sheet, and has an inclined surface according to the curved bottom of the support element; wherein the light source circuit unit (1) includes: a circuit substrate (11) that has a wiring pattern (14) on a surface thereof and includes a chip mounting layer (14C) as part of the wiring pattern (14), where the wiring pattern (14 ) is formed of light reflective material; one or more chips of light-emitting elements (13) that are directly placed in the chip assembly layer (14C), and are driven by a current that passes through the wiring pattern (14); a matrix bonding layer between the chip mounting layer (14C) and the chips; and a reflective sheet (23) with an opening corresponding to one or more light-emitting element chips (13) in the entire area above the circuit substrate (11), and a reflective layer that includes the same light-reflecting material as the wiring pattern (14) is provided in the area of an uncovered portion of the wiring pattern (14) on the circuit substrate (11) through the same printing step as that of the wiring pattern (14).
[0028]
Lighting device according to claim 27, characterized in that the pitch of the plurality of light-emitting element chips (13) arranged in one direction of the row is reduced with the decrease in the width of the accommodation space.
[0029]
Lighting device according to claim 28, characterized in that a drive current applied to the plurality of light-emitting element chips (13) is adjusted to allow the surface luminance to be uniform in response to the plurality of light-emitting element chips (13) arranged in the direction of the row.
[0030]
Display device, characterized by the fact that it comprises: a display panel; and a light source circuit unit (1) as a light source for the display panel; wherein the light source circuit unit (1) includes: a circuit substrate (11) that has a wiring pattern (14) on a surface thereof and includes a chip mounting layer (14C) as part of the wiring pattern (14), where the wiring pattern (14 ) is formed of light reflective material; and one or more chips of light-emitting elements (13) that are directly placed in the chip assembly layer (14C), and are driven by a current that passes through the wiring pattern (14); a reflective sheet (23) with an opening corresponding to one or more light-emitting element chips (13) in the entire area above the circuit substrate (11), and a reflective layer that includes the same light-reflecting material as the wiring pattern (14) is provided in the area of an uncovered portion of the wiring pattern (14) on the circuit substrate (11) through the same printing step as that of the wiring pattern (14).
[0031]
Illumination device according to claim 30, characterized by the fact that the light reflective material is a material that has a luminous character of high reflectance equal to or greater than 90% over the entire wavelength range of visible light.
[0032]
Lighting device according to claim 30 or 31, characterized by the fact that a sheet of metal radiating heat is laminated to the rear surface of the circuit substrate (11).

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法律状态:
2015-07-28| B03A| Publication of an application: publication of a patent application or of a certificate of addition of invention|

2018-12-18| B06F| Objections, documents and/or translations needed after an examination request according art. 34 industrial property law|

2019-08-06| B06U| Preliminary requirement: requests with searches performed by other patent offices: suspension of the patent application procedure|

2020-04-22| B09A| Decision: intention to grant|

2020-09-24| B16A| Patent or certificate of addition of invention granted|Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 16/03/2012, OBSERVADAS AS CONDICOES LEGAIS. |

优先权:

申请号 | 申请日 | 专利标题

JP2011-064582|2011-03-23|

JP2011064582A|JP2012204370A|2011-03-23|2011-03-23|Light source circuit unit, lighting device, and display device|

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